Shenzhen Hengstar Technology Co., Ltd.

Shenzhen Hengstar Technology Co., Ltd.

sales@angeltondal.com

86-755-89992216

Shenzhen Hengstar Technology Co., Ltd.
HomeprodukAksés Modél GreenalIngulif Memin Mémori Memimén WDD3

Ingulif Memin Mémori Memimén WDD3

Type pamayaran:
L/C,T/T,D/A
Incoterm:
FOB,EXW,CIF
Mnt. pesenan:
1 Piece/Pieces
kandaraan:
Ocean,Air,Express,Land
  • Panjelasan Produk
Overview
Atribut Produk

Model No.NSO4GU3AB

Kamampuhan Suplai & Émbaran Tambahan

kandaraanOcean,Air,Express,Land

Type pamayaranL/C,T/T,D/A

IncotermFOB,EXW,CIF

Bungkusan & Pangiriman
Ngical Unit:
Piece/Pieces

4GB 1600mhz 2000-pin DDR3 Udimm


Revisi sajarah

Revision No.

History

Draft Date

Remark

1.0

Initial Release

Apr. 2022

 

Mesen méja inpormasi

Model

Density

Speed

Organization

Component Composition

NS04GU3AB

4GB

1600MHz

512Mx64bit

DDR3 256Mx8 *16


Panjelasan
Hengstar henteu duka DDDR Ns0444ab mangrupikeun dua4-bit 6-bit dua bit 4GB 4GB DODR3-1100 CL11 1 SPD diprogram ka Jedec Stande State Dafry Timing 11-11-11 dina 1,5V. Unggal 240-pin dipasang nganggo ramo kontak emas. SDRAM dikaluarkeun dimm diturunkeun pikeun dianggo salaku mémori utama nalika dipasang dina Sistem sapertos PC sareng workstation.


Fitur
Perlindungan emberer: VDD = 1.5V (1.425V ka 1.575V)
·VDDQ = 1.5V (1,425V ka 1.575V)
800mhz fck pikeun 1600MB / detik / PIN
 bank internal mandiri
srogramcable CAP: 11, 10, 9, 8, 7, 6
Laténsi advensional ° (0, cl - 2, atanapi cl - 1 jam
8-bit pre-ackch
burst panjang: 8 (interleave tanpa wates, sules sareng alamat ngamimitian "000" "Ngan), 4 sareng TCCD = IBS
1-arah bédana data
 Kalibrasi diri internal liwat PIN ZQ (RZQ: 240 OHM ± 1%)
on paeh terminasi nganggo pin Okt
average refresh dina 7.8us di handap tibatan tali 85 ° C, 3.9us tabuh 85 ° C <95 ° C
·Antynchronous
Gaya data-output drive
fly-ku topologi
·Pcb: jangkungna 1.18 "(30mm)
rohs patuh sareng halogen-gratis


Parameter Waktu Kunci

MT/s

tRCD(ns)

tRP(ns)

tRC(ns)

CL-tRCD-tRP

DDR3-1600

13.125

13.125

48.125

2011/11/11


Méja alamat

Configuration

Refresh count

Row address

Device bank address

Device configuration

Column Address

Module rank address

4GB

8K

32K A[14:0]

8 BA[2:0]

2Gb (256 Meg x 8)

1K A[9:0]

2 S#[1:0]


Déskripsi PIN

Symbol

Type

Description

Ax

Input

Address inputs: Provide the row address  for ACTIVE commands, and the column
address and auto precharge bit (A10) for READ/WRITE commands, to select one location
out of the memory array in the respective bank. A10 sampled during a PRECHARGE
command determines whether the PRECHARGE applies to one bank (A10 LOW, bank
selected by BAx) or all banks (A10 HIGH). The address inputs also provide the op-code
during a LOAD MODE command. See the Pin Assignments table for density-specific
addressing information.

BAx

Input

Bank address inputs: Define the device bank to which an ACTIVE, READ, WRITE, or
PRECHARGE command is being applied. BA define which mode register (MR0, MR1,
MR2, or MR3) is loaded during the LOAD MODE command.

CKx,
CKx#

Input

Clock: Differential clock inputs. All control, command, and address input signals are
sampled on the crossing of the positive edge of CK and the negative edge of CK#.

CKEx

Input

Clock enable: Enables (registered HIGH) and disables (registered LOW) internal circuitry
and clocks on the DRAM.

DMx

Input

Data mask (x8 devices only): DM is an input mask signal for write data. Input data is
masked when DM is sampled HIGH, along with that input data, during a write access.
Although DM pins are input-only, DM loading is designed to match that of the DQ and DQS pins.

ODTx

Input

On-die  termination:  Enables  (registered  HIGH)  and  disables  (registered  LOW)
termination resistance internal to the DDR3 SDRAM. When enabled in normal operation,
ODT is only applied to the following pins: DQ, DQS, DQS#, DM, and CB. The ODT input will be ignored if disabled via the LOAD MODE command.

Par_In

Input

Parity input: Parity bit for Ax, RAS#, CAS#, and WE#.

RAS#,
CAS#,
WE#

Input

Command inputs: RAS#, CAS#, and WE# (along with S#) define the command being
entered.

RESET#

Input
(LVCMOS)

Reset: RESET# is an active LOW asychronous input that is connected to each DRAM and
the registering clock driver. After RESET# goes HIGH, the DRAM must be reinitialized as
though a normal power-up was executed.

Sx#

Input

Chip select: Enables (registered LOW) and disables (registered HIGH) the command
decoder.

SAx

Input

Serial address inputs: Used to configure the temperature sensor/SPD EEPROM address
range on the I2C bus.

SCL

Input

Serial
communication to and from the temperature sensor/SPD EEPROM on the I2C bus.

CBx

I/O

Check bits: Used for system error detection and correction.

DQx

I/O

Data input/output: Bidirectional data bus.

DQSx,
DQSx#

I/O

Data strobe: Differential data strobes. Output with read data; edge-aligned with read data;
input with write data; center-alig

SDA

I/O

Serial
sensor/SPD EEPROM on the I2C bus.

TDQSx,
TDQSx#

Output

Redundant data strobe (x8 devices only): TDQS is enabled/disabled via the LOAD
MODE command to the extended mode register (EMR). When TDQS is enabled, DM is
disabled and TDQS and TDQS# provide termination resistance; otherwise, TDQS# are no
function.

Err_Out#

Output (open
drain)

Parity error output: Parity error found on the command and address bus.

EVENT#

Output (open
drain)

Temperature event: The EVENT# pin is asserted by the temperature sensor when critical
temperature thresholds have been exceeded.

VDD

Supply

Power supply: 1.35V (1.283–1.45V) backward-compatible to 1.5V (1.425–1.575V). The
component VDD and VDDQ are connected to the module VDD.

VDDSPD

Supply

Temperature sensor/SPD EEPROM power supply: 3.0–3.6V.

VREFCA

Supply

Reference voltage: Control, command, and address VDD/2.

VREFDQ

Supply

Reference voltage: DQ, DM VDD/2.

VSS

Supply

Ground.

VTT

Supply

Termination voltage: Used for control, command, and address VDD/2.

NC

No connect: These pins are not connected on the module.

NF

No function: These pins are connected within the module, but provide no functionality.

Catetan : Méja PIN descress di handap nyaéta daptar gangguan anu lengkep dina pulsa pikeun sagala modul DDR3. Sadaya pin didaptarkeun tiasa henteu dirojong dina modul ieu. Tingali Tugas PIN pikeun inpormasi khusus pikeun modul ieu.


Diagram blok fungsional

4GB, modul 512mx64 (2ruk x8)

1


2


Catetan:
1.The Bal ZQ dina unggal komponén DDDD disambungkeun ka luar 240ω ka luar 240c ± 1% tahan utama anu dihijikeun ka taneuh. Hal ieu dianggo pikeun calibration komponen anu maot sareng supir kaluaran.



Dimensi modul


Pandangan hareup

3

Pandangan hareup

4

Catetan:
Ukuran 1.lensal aya dina milimeter (inci); Max / mnt atanapi khas (ngetik) dimana parios.
2.Serberance dina sagala dimensi ± 0.15mm kecuali didieu.
Diagram Neghancamal mangrupikeun rujukan ngan ukur.

Categories produk : Aksés Modél Greenal

Email pikeun supplier ieu
  • *taluk:
  • *ka:
    Mr. Jummary
  • *email:
  • *pesen:
    pesen anjeun kudu jadi antara 20-8000 karakter
HomeprodukAksés Modél GreenalIngulif Memin Mémori Memimén WDD3
Kirim surélék Panalungtikan
*
*

imah

Product

Phone

Tentang Kami

panalungtikan

Kami bakal ngahubungi anjeun langsung

Eusian langkung seueur inpormasi supados tiasa nyambung sareng anjeun gancang

Pernyataan privasi: Privasi anjeun penting pisan pikeun kami. Perusahaan urang jangji henteu ngungkabkeun inpormasi pribadi anjeun kana ijin anu jelas.

Ngirim